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Investigation and Compact Modeling of Hot-Carrier Injection for Read Disturbance in 3-D NAND Flash Memory

机译:三维NAND闪存中读干扰热载体喷射的调查和紧凑型建模

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摘要

A new compact model framework is presented to predict the read disturbance induced by hot-carrier injection (HCI) in 3-D NAND flash memory. The physical phenomena that occur during read operation such as band-to-band tunneling (BTBT), impact ionization (II), and HCI, are analyzed through computer-aided design (TCAD) simulation, and the correlations between each other are considered in the compact model. In particular, it is found that a negative feedback process occurs to HCI during read operation due to the geometrical characteristics of 3-D NAND flash. Owing to this phenomenon, time dynamic behavior of HCI is observed during the read operation. The proposed compact model framework includes all of these 3-D NAND flash features. It would help to predict HCI-induced read disturbance without many read measurements.
机译:提出了一种新的紧凑模型框架,以预测在3-D NAND闪存中通过载体喷射(HCI)引起的读取干扰。通过计算机辅助设计(TCAD)仿真分析读取操作期间发生的读取操作,诸如带对带隧道(BTBT),冲击电离(II)和HCI期间发生的物理现象,并且彼此之间的相关性被认为是紧凑的模型。特别地,发现由于3-D NAND闪光的几何特征,在读取操作期间发生负反馈过程。由于这种现象,在读取操作期间观察HCI的时间动态行为。所提出的紧凑型模型框架包括所有这些3-D NAND闪存功能。在没有许多读取测量的情况下,它将有助于预测HCI诱导的读取干扰。

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