...
首页> 外文期刊>Electron Devices, IEEE Transactions on >Physics-Based 2-D Analytical Model for Field-Plate Engineering of AlGaN/GaN Power HFET
【24h】

Physics-Based 2-D Analytical Model for Field-Plate Engineering of AlGaN/GaN Power HFET

机译:基于物理学的AlGaN / GaN功率HFET场板工程二维分析模型

获取原文
获取原文并翻译 | 示例
           

摘要

A physics-based 2-D analytical model is developed for AlGaN/GaN heterojunction field-effect transistor (HFET) to optimize the field-plate (FP) design for electric-field (E-field) engineering. The model reveals the impact of critical device parameters such as FP length, passivation dielectric, and dielectric thickness on the electric potential and E-field distribution in AlGaN/GaN HFET. With this model, a minimum FP length as well as the optimal dielectric thickness for different passivation dielectrics can be obtained to achieve a uniform E-field distribution and simultaneously at the minimized cost of parasitic capacitance. By taking the edge effect of both the gate and FP into account, the calculated results exhibit good agreement with numerical simulation. The developed model is of the great potential of high-voltage AlGaN/GaN HFET design for power switching applications.
机译:针对AlGaN / GaN异质结场效应晶体管(HFET)开发了基于物理学的二维分析模型,以优化电场(E-field)工程的场板(FP)设计。该模型揭示了关键器件参数(如FP长度,钝化电介质和电介质厚度)对AlGaN / GaN HFET中电势和电场分布的影响。利用该模型,可以获得不同钝化电介质的最小FP长度以及最佳电介质厚度,以实现均匀的电场分布,并同时以最小的寄生电容成本。通过考虑门和FP的边缘效应,计算结果与数值模拟显示出良好的一致性。开发的模型具有用于电源开关应用的高压AlGaN / GaN HFET设计的巨大潜力。

著录项

  • 来源
    《Electron Devices, IEEE Transactions on》 |2019年第1期|116-125|共10页
  • 作者单位

    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China;

    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    HEMTs; MODFETs; Aluminum gallium nitride; Wide band gap semiconductors; Logic gates; Passivation; Gallium nitride;

    机译:HEMT;MODFET;氮化铝镓;宽带隙半导体;逻辑门;钝化;氮化镓;

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号