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Model and Experiments of Small-Size Vertical Devices With Field Plate

机译:小型带场板垂直设备的模型与实验

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摘要

A small-size vertical device with field plate is designed and experimentally realized in this paper. The modulation effect of the field plate causes an enhanced bulk electric field (ENBULF) and improves the breakdown voltage V-B. A 2-D electric field model is developed to give the ENBULF condition corresponding to the maximum V-B and the optimal specific ON-resistance R-ON,R- p. Based on the model, the minimum figure of merit (FOM) (gate charge Q(g) x ON-resistance R-ON) is discussed for a typical ENBULF device, i.e., the shield-gate vertical double diffused metal-oxide-semiconductor (SG-VDMOS). The calculated results are in good agreement with the simulations. Furthermore, a 35-V SG-VDMOS is analytically designed and experimentally implemented, which obtains a R-ON, sp of 4.4 m Omega.mm(2) and a gate to drain chargeQ(g)d of 11.3 nC, respectively. The experiment realizes the minimal FOM and a R-ON,(sp) reduced by 28.6% when compared with the conventional "silicon limit."
机译:本文设计并实验实现了一种小型的带场板的垂直装置。场板的调制效应导致增强的体电场(ENBULF)并提高了击穿电压V-B。建立了二维电场模型,以给出对应于最大V-B和最佳导通电阻R-ON,R- p的ENBULF条件。基于该模型,讨论了典型ENBULF器件的最小品质因数(FOM)(栅极电荷Q(g)x导通电阻R-ON),即屏蔽栅垂直双扩散金属氧化物半导体(SG-VDMOS)。计算结果与仿真结果吻合良好。此外,通过分析设计并通过实验实现了35V SG-VDMOS,该R-ON的sp值为4.4 m Omega.mm(2),栅漏电荷Q(g)d为11.3 nC。与传统的“硅限制”相比,该实验实现了最小的FOM和R-ON(sp)降低了28.6%。

著录项

  • 来源
    《IEEE Transactions on Electron Devices》 |2019年第3期|1416-1421|共6页
  • 作者单位

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China|Univ Elect Sci & Technol China, Inst Elect & Informat Engn, Dongguan 523808, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China|Univ Elect Sci & Technol China, Inst Elect & Informat Engn, Dongguan 523808, Peoples R China;

    CSMC Technol Corp, Technol Dev Dept, Wuxi 214061, Peoples R China;

    CSMC Technol Corp, Technol Dev Dept, Wuxi 214061, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;

    Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Enhanced bulk electric field (ENBULF); gate charge; minimum figure of merit (FOM); shield-gate vertical double diffused metal-oxide-semiconductor (SG-VDMOS); specific ON-resistance;

    机译:增强体电场(ENBULF);栅极电荷;最低品质因数(FOM);屏蔽栅极垂直双扩散金属氧化物半导体(SG-VDMOS);特定的导通电阻;

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