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Effects of localized interface defects caused by hot-carrier stress in n-channel MOSFETs at low temperature

机译:低温下n沟道MOSFET中热载流子应力引起的局部界面缺陷的影响

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Hot-carrier stressing was carried out on 1- mu m n-type MOSFETs at 77 K with fixed drain voltage V/sub d/=5.5 V and gate voltage V/sub g/ varying from 1.5 to 6.5 V. It was found that the maximum transconductance degradation Delta G/sub m/ and threshold voltage shift Delta V/sub t/, do not occur at the same V/sub g/. As well, Delta K/sub t/ is very small for the V/sub g/>V/sub d/ stress regime, becomes significant at V/sub g/ approximately=V/sub d/, and then increases rapidly with increasing V/sub g/, whereas Delta G/sub m/ has its maximum maximum in the region of maximum substrate current. The behavior is explained by the localized nature of induced defects, which is also responsible for a distortion of the transconductance curves and even a slight temporary increase in the transconductance during stress.
机译:在固定的漏极电压V / sub d / = 5.5 V和栅极电压V / sub g /在1.5到6.5 V之间变化的情况下,在77 m的1-μmn型MOSFET上执行热载流子应力。发现最大跨导衰减量Delta G / sub m /和阈值电压偏移量Delta V / sub t /在相同的V / sub g /下不会出现。同样,对于V / sub g /> V / sub d /应力状态,Delta K / sub t /很小,在V / sub g /大约等于V / sub d /时显着,然后随着增加而迅速增加V / sub g /,而Delta G / sub m /在最大基板电流区域具有最大最大值。该行为由感应缺陷的局部性质来解释,这也导致跨导曲线变形,甚至在应力作用下跨导略有暂时性增加。

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