首页> 外文期刊>IEEE Electron Device Letters >Impact of surface layer on In/sub 0.52/Al/sub 0.48/As/In/sub 0.53/Ga/sub 0.47/As/InP high electron mobility transistors
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Impact of surface layer on In/sub 0.52/Al/sub 0.48/As/In/sub 0.53/Ga/sub 0.47/As/InP high electron mobility transistors

机译:表面层对In / sub 0.52 / Al / sub 0.48 / As / In / sub 0.53 / Ga / sub 0.47 / As / InP高电子迁移率晶体管的影响

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The surface potential of FETs has shown a strong effect on the channel potential and charge control in the channel. A study of the role of undoped versus doped cap layers in In/sub 0.52/Al/sub 0.48/As-In/sub 0.53/Ga/sub 0.47/As-InP high-electron-mobility transistors (HEMT) is discussed. As the result of surface potential effect, direct comparison of 0.3*150- mu m/sup 2/ gate devices yielded improved gate breakdown characteristics and a DC output conductance of less than 15 mS/mm for the surface undoped structure compared to 50 mS/mm for the doped structure. The surface undoped MEMT achieved a very high maximum stable gain of 19.2 dB compared to 16.0 dB for the surface doped HEMT at 18 GHz, largely due to the improved g/sub m//g/sub 0/ ratio. This study demonstrates that control of the surface potential in In/sub 0.52/Al/sub 0.48/As-In/sub 0.53/Ga/sub 0.47/As-InP HEMTs is consistent with the effect of a gate recess in MESFETs. This study also shows that, in achieving high-gain applications of HEMTs, the surface potential near the gate edge should be optimized through unconventional surface layer design.
机译:FET的表面电势已对沟道电势和沟道中的电荷控制产生了强烈影响。讨论了In / sub 0.52 / Al / sub 0.48 / As-In / sub 0.53 / Ga / sub 0.47 / As-InP高电子迁移率晶体管(HEMT)中未掺杂和掺杂盖层的作用。由于表面电势效应,直接比较0.3 *150μm/ sup 2 /栅极器件产生的栅极击穿特性得到了改善,而表面无掺杂结构与50 mS / s相比,直流输出电导小于15 mS / mm。毫米为掺杂结构。表面未掺杂的MEMT实现了19.2 dB的非常高的最大稳定增益,而18 GHz时表面掺杂的HEMT的最大稳定增益为16.0 dB,这主要是由于g / sub m // g / sub 0 /比率的提高。这项研究表明,控制In / sub 0.52 / Al / sub 0.48 / As-In / sub 0.53 / Ga / sub 0.47 / As-InP HEMT中的表面电势与MESFET中栅极凹槽的作用是一致的。这项研究还表明,在实现HEMT的高增益应用时,应通过非常规的表面层设计来优化栅极边缘附近的表面电势。

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