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首页> 外文期刊>IEEE Electron Device Letters >New hot-carrier degradation mode in PMOSFETs with W gate electrodes
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New hot-carrier degradation mode in PMOSFETs with W gate electrodes

机译:具有W栅电极的PMOSFET中的新的热载流子降解模式

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摘要

Hot-carrier degradation of W gate PMOSFETs, which are surface-channel devices because of the work function of W, has been investigated in comparison with polycide (WSi/sub x//sup +/ poly-Si) ones. In W gate PMOSFETs, transconductance g/sub m/ and threshold voltage V/sub th/ decrease on the drain avalanche hot-carrier (DAHC) stress, and Delta g/sub m//g/sub m0/ and Delta V/sub th/ become minimum at V/sub G/ equivalent to V/sub D//2. By using the charge-pumping technique, it is found that, after stressing at the same stress condition, the interface state density of W gate devices is about 10 times larger than that of polycide ones but the densities of trapped electrons are almost equal. These results indicate that the difference of hot-carrier degradation between W and polycide gate devices is mainly caused by the difference of the interface state density.
机译:W栅极PMOSFET由于W的功函数而成为表面沟道​​器件,其热载流子退化已与多晶硅化物(WSi / sub x // n / sup + / poly-Si)进行了比较。在W栅极PMOSFET中,漏雪崩热载流子(DAHC)应力上的跨导g / sub m /和阈值电压V / sub th /减小,Delta g / sub m // g / sub m0 /和Delta V / sub在V / sub G /时等于V / sub D // 2,th /变为最小值。通过使用电荷泵技术,发现在相同的应力条件下施加应力后,W栅极器件的界面态密度大约是多晶硅化物的界面态密度的10倍,但被俘获电子的密度几乎相等。这些结果表明W和多晶硅化物栅极器件之间的热载流子降解的差异主要是由界面态密度的差异引起的。

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