机译:高电压(<1kV)和高电流增益(32)4H-SiC功率BJT,使用无铝欧姆接触到基极
ECE Dept., Rutgers Univ., Piscataway, NJ, USA;
silicon compounds; power bipolar transistors; ohmic contacts; high-temperature electronics; current density; semiconductor device measurement; wide band gap semiconductors; semiconductor device breakdown; 4H-SiC power BJTs; Al-free ohmic contact; design; fabrication; 4H-SiC bipolar junction transistors; high voltage; high dc current gain; collector current level; blocking voltage; specific on-resistance; 25 to 200 C; 1011 V; SiC; Ti-TiN;
机译:新型4H-SiC BJT,利用基极中的浮动掩埋层实现高电流增益,高电流增益稳定性和高击穿电压
机译:发射极宽度和发射极-基极距离对4H-SiC功率BJT中电流增益的影响
机译:以高k电介质为界面层的4H-SiC BJT的电流增益和击穿电压的改善
机译:温度对功率4H-SiC BJT基极电流增益的影响分析
机译:使用分子束外延研究基于氮化镓的电力电子设备的欧姆接触。
机译:在不同的注入后退火后p型铝注入的4H-SiC层上的欧姆接触
机译:4H-siC功率BJT具有高电流增益和低导通电阻