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12-kV p-Channel IGBTs With Low On-Resistance in 4H-SiC

机译:在4H-SiC中具有低导通电阻的12kV p沟道IGBT

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SiC bipolar devices are favored over SiC unipolar devices for applications requiring breakdown voltage in excess of 10 kV. We have designed and fabricated p-channel insulated-gate bipolar transistors (IGBTs) in 4H-SiC with 12-kV blocking voltage for high-power applications. A differential on-resistance of 18.6 $hbox{m}Omegacdothbox{cm}^{2}$ was achieved with a gate bias of 16 V, corresponding to a forward voltage drop of 5.3 V at 100 $ hbox{A/cm}^{2}$, indicating strong conductivity modulation in the p-type drift region. A moderately doped current enhancement layer grown on the lightly doped drift layer effectively reduces the JFET resistance while maintaining a high carrier lifetime for conductivity modulation. The p-channel IGBT (p-IGBT) exhibits a transconductance that is $hbox{3}times$ higher than that of the 12-kV n-channel SiC IGBTs. An inductive switching test was done at 1.5 kV and 0.55 A $(sim !!hbox{140} hbox{A/cm}^{2})$ for the p-IGBTs, and a turn-on time of 40 ns and a turn-off time of $sim !!hbox{2.8} muhbox{s}$ were measured.
机译:对于击穿电压超过10 kV的应用,SiC双极器件比SiC单极器件更受青睐。我们以4H-SiC设计和制造了具有12kV阻断电压的p沟道绝缘栅双极晶体管(IGBT),用于大功率应用。栅极偏置为16 V时,实现了18.6 $ hbox {m} Omegacdothbox {cm} ^ {2} $的导通电阻差分,对应于100 $ hbox {A / cm} ^时的正向压降5.3 V {2} $表示在p型漂移区中的强电导率调制。生长在轻掺杂漂移层上的中度掺杂电流增强层可有效降低JFET电阻,同时保持高载流子寿命以进行电导率调制。 p沟道IGBT(p-IGBT)的跨导性比12 kV n沟道SiC IGBT高出hbox {3}倍。对p-IGBT进行了1.5 kV和0.55 A $(sim !! hbox {140} hbox {A / cm} ^ {2})$的电感开关测试,其导通时间为40 ns。测量$ sim !! hbox {2.8} muhbox {s} $的关闭时间。

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