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12 kV 4H-SiC p-IGBTs with Record Low Specific On-resistance

机译:具有创纪录的低导通电阻的12 kV 4H-SiC p-IGBT

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DC characteristics of 4H-SiC p-channel IGBTs capable of blocking -12 kV and conducting -0.4 A (-100 A/cm~2) at a forward voltage of-5.2 V at 25°C are demonstrated for the first time. A record low differential on-resistance of 14 mΩ·cm was achieved with a gate bias of -20 V indicating a strong conductivity modulation in the p-type drift region. A moderately doped current enhancement layer grown on the lightly doped drift layer effectively reduces the JFET resistance while maintains a high carrier lifetime for conductivity modulation. A hole MOS channel mobility of 12.5 cm~2/V-s at -20 V of gate bias was measured with a MOS threshold voltage of-5.8 V. The blocking voltage of-12 kV was achieved by Junction Termination Extension (JTE).
机译:第一次对能够阻断-12kV和在25℃的前电压下封闭-12kV并导电的4H-SiC p沟道IGBT的DC特性在-5.2V的正向电压下进行。通过-20V的栅极偏置,实现了14mΩ·cm的记录低差分导电电阻,该栅极偏置指示p型漂移区域中的强电导率调制。在轻掺杂的漂移层上生长的适度掺杂电流增强层有效地降低了JFET电阻,同时保持了用于电导调制的高载流子寿命。使用-5.8V的MOS阈值电压测量12.5cm〜2 / V-S的孔MOS通道迁移率为-20V栅极偏置。通过结终端延伸(JTE)实现-12kV的阻塞电压。

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