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Temperature-Compensated High-Frequency Surface Acoustic Wave Device

机译:温度补偿高频表面声波器件

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We report high-frequency surface acoustic wave (SAW) devices with excellent temperature stability using a layered structure consisting of single-crystal ${rm LiNbO}_{3}$ thin film on ${rm SiO}_{2}/{rm LiNbO}_{3}$ substrate. SAW devices with a wavelength of 2 $mu{rm m}$ have been fabricated and several wave modes ranging from ${sim}{1.5}$ to 2.1 GHz have been obtained. With the ${rm SiO}_{2}$ interlayer providing the temperature compensation and the top single-crystal Z-cut ${rm LiNbO}_{3}$ piezoelectric thin film for acoustic wave excitation, the fabricated SAW devices exhibit excellent temperature coefficients of frequency. Theoretical calculations are presented to elucidate temperature compensation of the proposed layered structure.
机译:我们报告了具有由单晶$ {rm LiNbO} _ {3} $薄膜在$ {rm SiO} _ {{2} / {rm}上构成的分层结构的具有出色温度稳定性的高频表面声波(SAW)器件LiNbO} _ {3} $衬底。已经制造了具有2μmrmm波长的SAW器件,并且已经获得了从$ {sim} {1.5} $到2.1GHz的几种波模。通过$ {rm SiO} _ {2} $中间层提供温度补偿和顶部单晶Z切割$ {rm LiNbO} _ {3} $压电薄膜用于声波激励,所制造的SAW器件表现出出色的性能。频率温度系数。提出了理论计算以阐明所提出的分层结构的温度补偿。

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