首页> 外文期刊>IEEE Electron Device Letters >Electrical Characterization and Materials Stability Analysis of ${rm La}_{2}{rm O}_{3}/{rm HfO}_{2}$ Composite Oxides on n-${rm In}_{0.53}{rm Ga}_{0.47}{rm As}$ MOS Capacitors With Different Annealing Temperatures
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Electrical Characterization and Materials Stability Analysis of ${rm La}_{2}{rm O}_{3}/{rm HfO}_{2}$ Composite Oxides on n-${rm In}_{0.53}{rm Ga}_{0.47}{rm As}$ MOS Capacitors With Different Annealing Temperatures

机译:$ {rm La} _ {2} {rm O} _ {3} / {rm HfO} _ {2} $ n-$ {rm In} _ {{0.53} {rm}上的复合氧化物的电特性和材料稳定性分析Ga} _ {0.47} {rm As} $具有不同退火温度的MOS电容器

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摘要

In this letter, a high-k composite oxide composed of ${rm La}_{2}{rm O}_{3}$ and ${rm HfO}_{2}$ is investigated for n-${rm In}_{0.53}{rm Ga}_{0.47}{rm As}$ metal–oxide–semiconductor (MOS) capacitor application. The composite oxide was formed by depositing five layers of ${rm La}_{2}{rm O}_{3}$ (0.8 nm)/${rm HfO}_{2}$ (0.8 nm) on InGaAs with post deposition annealing at 500$^{circ}{rm C}$. The MOS capacitors fabricated show good inversion behavior, high capacitance, low leakage current, with excellent interface trap density $(D_{{rm it}})$ of $7.0times 10^{11}~{rm cm}^{-2}{rm eV}^{-1}$, small hysteresis of 200 mV and low capacitance equivalent thickness of 2.2 nm at 1 kHz were also achieved.
机译:在这封信中,研究了由$ {rm La} _ {2} {rm O} _ {3} $和$ {rm HfO} _ {2} $组成的高k复合氧化物的n-$ {rm In } _ {0.53} {rm Ga} _ {0.47} {rm As} $金属-氧化物-半导体(MOS)电容器应用。通过在InGaAs上沉积五层$ {rm La} _ {2} {rm O} _ {3} $(0.8 nm)/ $ {rm HfO} _ {2} $(0.8 nm)形成复合氧化物沉积后退火温度为500 $ ^ {circ} {rm C} $。所制造的MOS电容器具有良好的反转性能,高电容,低泄漏电流,并且具有出色的界面陷阱密度$(D _ {{rm it}})$$ 7.0乘以10 ^ {11}〜{rm cm} ^ {-2}还实现了{rm eV} ^ {-1} $,200 mV的小磁滞和在1 kHz时2.2 nm的低电容等效厚度。

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