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AlGaN/GaN Schottky Barrier Diodes on Silicon Substrates With Selective Si Diffusion for Low Onset Voltage and High Reverse Blocking

机译:具有选择性Si扩散的硅衬底上的AlGaN / GaN肖特基势垒二极管,用于低起始电压和高反向阻断

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In this letter, a selective Si diffusion approach is proposed to improve both the forward and reverse characteristics of AlGaN/GaN Schottky barrier diodes on Si substrates. The Si diffusion layer forms a dual Schottky barrier anode structure, which results in a low Schottky barrier portion to reduce the onset voltage $V_{rm ON}$ from 1.3 to 1.0 V (23%). In the same process step, the selectively diffused Si is adopted in the cathode to reduce the ohmic contact resistance $R_{rm C}$ and improve the breakdown voltage $V_{rm BK}$ . A low $R_{rm C}$ of 0.21 $Omegacdot{rm mm}$ and enhanced $V_{rm BK}$ up to 20% (from 1250 to 1500 V) are demonstrated, which can be attributed to the alleviated electric-field peaks around the alloy spikes beneath the ohmic contact.
机译:在这封信中,提出了一种选择性的Si扩散方法,以改善Si衬底上的AlGaN / GaN肖特基势垒二极管的正向和反向特性。 Si扩散层形成双重肖特基势垒阳极结构,这导致肖特基势垒部分较低,从而降低了起始电压<公式> tex> 从1.3到1.0 V(23%)。在同一工艺步骤中,在阴极中采用选择性扩散的Si来降低欧姆接触电阻<公式> =“ Rin {Te C”> $ R_ {rm C} $ 并改善击穿电压 $ V_ {rm BK} $ 。 <公式公式> =“ inline”> $ R_ {rm C} $ 的值为0.21 $ Omegacdot {rm mm} $ 和增强的 $ V_ {rm BK} $ 证实了高达20%(从1250到1500 V),这可以归因于在欧姆接触下方的合金尖峰周围的减轻的电场峰值。

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