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A Temperature-Compensated Gallium Nitride Micromechanical Resonator

机译:温度补偿的氮化镓微机械谐振器

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A GaN bulk acoustic wave resonator is presented in this letter, showing fundamental thickness-mode resonance at 2.18 GHz, with a quality factor () of 655 and a coupling coefficient () of 1%. The resonator is integrated with an AlGaN/GaN high electron mobility transistor (HEMT); the integrated resonator/HEMT structure is coated with a silicon dioxide (SiO) passivation layer. It is shown that a 400-nm-thick SiO layer reduces the temperature coefficient of frequency (TCF) of the GaN-based resonator by >50%, while improving and of the fundamental thickness-mode resonance. The effect of SiO passivation layer is studied on , , and TCF of the device. Furthermore, the effects of temperature and input RF power on the resonator performance are characterized.
机译:在这封信中介绍了一个GaN体声波谐振器,它显示了在2.18 GHz处的基本厚度模式谐振,质量因子()为655,耦合系数()为1%。该谐振器与AlGaN / GaN高电子迁移率晶体管(HEMT)集成在一起;集成的谐振器/ HEMT结构涂有二氧化硅(SiO)钝化层。结果表明,厚度为400nm的SiO层可将GaN基谐振器的频率温度系数(TCF)降低> 50%,同时改善基本厚度模式谐振。研究了SiO钝化层对器件的,和TCF的影响。此外,还表征了温度和输入RF功率对谐振器性能的影响。

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