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Impact of Single Trap Random Telegraph Noise on Heterojunction TFET SRAM Stability

机译:单阱随机电报噪声对异质结TFET SRAM稳定性的影响

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摘要

We investigate the effect of a single charge trap random telegraph noise (RTN)-induced degradation in III-V heterojunction tunnel FET (HTFET)-based SRAM. Our analysis focuses on Schmitt trigger (ST) mechanism-based variation tolerant ten-transistor SRAM. We compare iso-area SRAM cell configurations in Si-FinFET and HTFET. Our results show that HTFET ST SRAMs provide significant energy/performance enhancements even in the presence of RTN. For sub-0.2 V operation (Vcc), HTFET ST SRAM offers 15% improvement in read-write noise margins along with better variation immunity from RTN over Si-FinFET ST SRAM. A comparison with iso-area 6T Si-FinFET SRAM with wider size transistors shows 43% improved read noise margin in 10T HTFET ST SRAM at ${rm Vcc}=0.175~{rm V}$. In addition, HTFET ST SRAM exhibits 48X lower read access delay and 1.5X reduced power consumption over Si-FinFET ST SRAM operating at their respective Vcc-min.
机译:我们研究基于III-V异质结隧道FET(HTFET)的SRAM中单个电荷陷阱随机电报噪声(RTN)引起的退化的影响。我们的分析集中于基于施密特触发器(ST)机制的耐变化的十晶体管SRAM。我们比较了Si-FinFET和HTFET中的等面积SRAM单元配置。我们的结果表明,即使在存在RTN的情况下,HTFET ST SRAM也可以显着提高能量/性能。对于低于0.2 V的工作电压(Vcc),与Si-FinFET ST SRAM相比,HTFET ST SRAM的读写噪声容限提高了15%,并且具有更好的抗RTN变异性的能力。与具有更大尺寸晶体管的等面积6T Si-FinFET SRAM的比较显示,在$ {rm Vcc} = 0.175〜{rm V} $的情况下,10T HTFET ST SRAM的读取噪声容限提高了43%。此外,与以各自的Vcc-min工作的Si-FinFET ST SRAM相比,HTFET ST SRAM的读取访问延迟降低了48倍,功耗降低了1.5倍。

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