首页> 外文期刊>Electron Device Letters, IEEE >Surface Acceptor-Like Trap Model for Gate Leakage Current Degradation in Lattice-Matched InAlN/GaN HEMTs
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Surface Acceptor-Like Trap Model for Gate Leakage Current Degradation in Lattice-Matched InAlN/GaN HEMTs

机译:晶格匹配的InAlN / GaN HEMT中栅漏电流退化的表面受体样陷阱模型

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摘要

Typical leakage current degradation behaviors are observed in lattice-matched InAlN/GaN Schottky structure, suggesting that the inverse piezoelectric effect may not be the major mechanism causing gate degradation in the stress-free GaN HEMTs. The low-field current is dominated by Poole–Frenkel emission of electrons with the compensation effect, indicative of the presence of deep-level acceptor-like traps in the surface barrier layer. A new surface cceptor-like trap model is developed to address the degradation kinetics, emphasizing that the high-field Fowler–Nordheim tunneling process may cause the generation of the acceptor-like defects, which could in turn introduce a thinner surface barrier to enhance the tunneling component, and the corresponding threshold voltage should determine the critical voltage of gate degradation.
机译:在晶格匹配的InAlN / GaN肖特基结构中观察到典型的泄漏电流退化行为,这表明逆压电效应可能不是导致无应力GaN HEMT中栅极退化的主要机制。低场电流以具有补偿效应的电子Poole-Frenkel发射为主,这表明在表面势垒层中存在像受体一样的深能级陷阱。开发了一种新的表面受体样陷阱模型,以解决降解动力学问题,强调高场Fowler-Nordheim隧穿过程可能会导致受体样缺陷的产生,从而可能引入较薄的表面势垒来增强表面隧穿分量和相应的阈值电压应确定栅极退化的临界电压。

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