首页> 外文期刊>Electron Device Letters, IEEE >Ultra-High Bit Density 3D NAND Flash-Featuring-Assisted Gate Operation
【24h】

Ultra-High Bit Density 3D NAND Flash-Featuring-Assisted Gate Operation

机译:超高比特密度3D NAND闪存辅助栅极操作

获取原文
获取原文并翻译 | 示例

摘要

Lower saturation current flowing through the same cell twice is a major drawback of vertical stack array transistor architecture. A loading effect further reduces the saturation current and causes higher threshold voltage. A simple word line cut process not only doubles the bit density to reduce the bit cost, but also reduces the loading effect. This letter used an assisted gate can to further enhance the saturation current with acceptable cell characteristics. Furthermore, the major parameters that influence the performance of the vertical stack array transistor architecture were studied extensively. An ultra-high density three-dimensional NAND flash architecture can be used in the future NAND flash industry.
机译:两次流过同一单元的较低饱和电流是垂直堆栈阵列晶体管架构的主要缺点。负载效应进一步降低了饱和电流并导致更高的阈值电压。简单的字线切割工艺不仅使位密度加倍以降低位成本,而且降低了加载效果。这封信使用了辅助栅极可以以可接受的电池特性进一步提高饱和电流。此外,广泛研究了影响垂直堆叠阵列晶体管架构性能的主要参数。超高密度三维NAND闪存架构可用于未来的NAND闪存行业。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号