首页> 外文期刊>Display Technology, Journal of >Improving the Vertical Light-Extraction Efficiency of GaN-Based Thin-Film Flip-Chip LEDs With p-Side Deep-Hole Photonic Crystals
【24h】

Improving the Vertical Light-Extraction Efficiency of GaN-Based Thin-Film Flip-Chip LEDs With p-Side Deep-Hole Photonic Crystals

机译:使用p侧深孔光子晶体提高GaN基薄膜倒装芯片LED的垂直光提取效率

获取原文
获取原文并翻译 | 示例
       

摘要

This study systematically investigates the light-extraction efficiency (LEE) of GaN-based thin-film flip-chip light-emitting diodes (TFFC LEDs) with deeply etched photonic crystals (PhC). The optimal structure can be obtained by scanning the structural parameters using a three-dimensional finite-difference time-domain simulation. The concentration of the internal emission pattern within a limited extraction cone is significantly influenced by several structural parameters. The light-collection enhancement within an extraction cone explains the peak LEE caused by optimized structural parameters such as the p-GaN thickness, the air-hole depth, the lattice constant and the filling factor. The maximum extraction efficiency can reach 65% in the case of a p-GaN thickness of 140 nm, air-hole depth of 240 nm, lattice constant of 350 nm and filling factor of 0.40. Additionally, fabricating the optimal electrical contacts on the planar top surface of the n side can contribute to a higher potential enhancement.
机译:这项研究系统地研究了具有深蚀刻光子晶体(PhC)的GaN基薄膜倒装芯片发光二极管(TFFC LED)的光提取效率(LEE)。可以通过使用三维有限差分时域仿真扫描结构参数来获得最佳结构。有限的萃取锥内的内部发射模式的浓度受几个结构参数的影响很大。提取锥内的集光增强说明了由优化的结构参数(例如p-GaN厚度,气孔深度,晶格常数和填充因子)导致的LEE峰值。在p-GaN厚度为140 nm,气孔深度为240 nm,晶格常数为350 nm和填充系数为0.40的情况下,最大提取效率可以达到65%。另外,在n侧的平坦顶表面上制造最佳电接触可以有助于更高的电势增强。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号