Research on Surface Processing of Quartz Wafer Based on Magnetorheological Finishing and Ion Beam Figuring

摘要

The common methods of manufacturing the quartz wafer are grinding and finishing. These processes not only cause micron-scale flaws, but also limit the accuracy. In this paper, firstly, magnetorheological finishing (MRF) technology is applied as the follow-up treatment of traditional process to correct the defects on the surface of the wafer. Then ion beam figuring (IBF) technology is used to improve the surface figure accuracy to nanoscale. After MRF, micron-scale scratches and pit defects on the surface are effectively eliminated, and the Rq value of the surface roughness descends from 2.46 nm to less than 1 nm. Meanwhile, the RMS value of the surface accuracy descend from 35.60 nm to 5.06 nm through IBF. The experimental results show that MRF and IBF technology can improve the surface quality of the quartz wafer.