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A Study on High Density Gate-Oxide Anti-Fuse PROM Memory Cell Program Features

机译:高密度栅氧化物反熔丝PROM存储单元程序特性研究

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The program consistency of high density gate-oxide anti-fuse PROM (programmable read only memory) memory cell is considered in this paper. To solve this problem, we do research on the mechanism and models of gate-oxide break down. A test chip based on 2T memory cell is also designed for the experiment. During the test, we have found that the program consistency of 2T cell is really pessimistic. What’s more, the program voltage has effect on the consistency. Through research and test, we have got the optimal program voltage-6.5V for 2T memory cell in 180nm technology. To further improve the consistency, we modify the 2T memory cell and propose a 3T memory cell. It consumes 18% more area, but the standard deviation of equivalent resistance decreases 15.3% in the worst situation. The deviation can decrease 80.3% at most. The program consistency is greatly improved.
机译:本文考虑了高密度栅氧化物反熔丝PROM(可编程只读存储器)存储单元的程序一致性。为了解决这个问题,我们对栅氧化分解的机理和模型进行了研究。实验还设计了基于2T存储单元的测试芯片。在测试过程中,我们发现2T单元的程序一致性确实很悲观。而且,程序电压会影响一致性。通过研究和测试,我们获得了适用于180nm技术的2T存储器单元的最佳编程电压-6.5V。为了进一步提高一致性,我们修改了2T存储单元并提出了3T存储单元。它消耗的面积增加了18%,但是在最坏的情况下,等效电阻的标准偏差降低了15.3%。偏差最多可以减少80.3%。程序一致性大大提高。

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