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High-Density FinFET One-Time Programmable Memory Cell With Intra-Fin-Cell-Isolation Technology

机译:采用鳍内单元隔离技术的高密度FinFET一次性可编程存储单元

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The one-time programmable (OTP) cell with intra-Fin-cell-isolation (IFCI) on the FinFET high-k metal gate (HKMG) CMOS process is proposed and demonstrated. The field-enhanced dielectric breakdown at Fin corners enables this OTP cell to be operated at low program voltage with fast program speed. The new intra-Fin cell-to-cell isolation eliminates the required wide spacing in the conventional isolation schemes, which successfully shields the neighboring cells from program and read disturbs. Without introducing extra masks or process steps, the CMOS compatible IFCI OTP cell achieves an ultrasmall cell size of 0.076 . More than six orders of ON-/OFF-read window is achieved under 4 V programming within 20 .
机译:提出并演示了在FinFET高k金属栅极(HKMG)CMOS工艺上具有内部Fin-cell隔离(IFCI)的一次性可编程(OTP)单元。 Fin角处的场增强电介质击穿使该OTP单元能够以低编程电压和快速编程速度运行。新的Fin内部单元间隔离消除了传统隔离方案中所需的宽间距,从而成功地将相邻单元屏蔽了编程和读取干扰。无需引入额外的掩模或工艺步骤,CMOS兼容的IFCI OTP单元可实现0.076的超小单元尺寸。在20 V以内的4 V编程下,可以实现超过六个阶的ON / OFF读取窗口。

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