Effect of Plasma Cleaning Process in the Wettability of Flip Chip PBGA Substrate of Integrated Circuit Packages

N. Amin; A.Y. Cheah; I. Ahmad

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Effect of Plasma Cleaning Process in the Wettability of Flip Chip PBGA Substrate of Integrated Circuit Packages

机译：等离子体清洗工艺对集成电路封装倒装芯片PBGA基板润湿性的影响

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This study investigated the plasma cleaning effect on two different commercially available packaging substrates used in the flip chip PBGA substrates for integrated circuit packaging. Investigation and related evaluation have been carried out to determine

机译：这项研究调查了在用于集成电路封装的倒装芯片PBGA基板中使用的两种不同的商用封装基板上的等离子体清洁效果。已进行调查和相关评估以确定

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《Journal of Applied Sciences》 |2010年第9期|共5页
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N. Amin; A.Y. Cheah; I. Ahmad;
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中图分类农业科学;
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1. Effect of Size of Lid-Substrate Adhesive on Reliability of Solder Balls in Thermally Enhanced Flip Chip PBGA Packages [J] . Jen Y.-M., Fang C.-K., Yeh Y.-H. IEEE Transactions on Components and Packaging Technologies . 2006,第期

机译：盖基板粘合剂的尺寸对热增强倒装芯片PBGA封装中焊球可靠性的影响
2. A novel flip-chip interconnection process for integrated circuits [J] . Mark W Sugden, David A. Hutt, David C. Whalley, Circuit World . 2012,第4期

机译：一种新颖的集成电路倒装芯片互连工艺
3. An Investigation into the Package and Printed Circuit Board Assembly Solutions of an Ultrathin Coreless Flip-Chip Substrate [J] . Chang Jing-Yao, Chaung Tung-Han, Chang Tao-Chih Journal of Electronic Materials . 2015,第10期

机译：超薄无芯倒装芯片基板的封装和印刷电路板组装解决方案的研究
4. The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA [C] . Amin Nowshad, Cheah Ang Ye, Kornain Zainudin, IEEE International Conference on Semiconductor Electronics . 2008

机译：清洁和无清洁通量在增强共晶焊料凸屑芯片PBGA的润湿性方面的影响
5. Integrated flip-chip flex-circuit packaging for power electronics applications. [D] . Xiao, Ying. 2003

机译：用于电力电子应用的集成倒装芯片柔性电路封装。
6. Flexible packaging of solid-state integrated circuit chips with elastomeric microfluidics [O] . Bowei Zhang, Quan Dong, Can E. Korman, -1

机译：带有弹性微流体的固态集成电路芯片的软包装
7. Effect of Plasma Cleaning Process in the Wettability of Flip Chip PBGA Substrate of Integrated Circuit Packages [O] . N. Amin, A.Y. Cheah, I. Ahmad 2010

机译：等离子体清洁过程在集成电路包装倒装芯片PBGA基板的润湿性中的影响
8. Development of ultraviolet-ozone cleaning as a production process in the packaging of integrated circuits. [R] . Garrett, S. E. 1990

机译：开发紫外线 - 臭氧清洁作为集成电路封装中的生产工艺。

Effect of Plasma Cleaning Process in the Wettability of Flip Chip PBGA Substrate of Integrated Circuit Packages

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