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Integrated circuit chip and flip chip package having the integrated circuit chip
Integrated circuit chip and flip chip package having the integrated circuit chip
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机译:集成电路芯片和具有该集成电路芯片的倒装芯片封装
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摘要
In an integrated circuit (IC) chip and a flip chip package having the same, no wiring line is provided and the first electrode pad does not make contact with the wiring line in a pad area of the IC chip. Thus, the first bump structure makes contact with the first electrode regardless of the wiring line in the pad area. The second electrode pad makes contact with the wiring line in a pseudo pad area of the IC chip. Thus, the second bump structure in the pseudo pad area makes contact with an upper surface of the second electrode at a contact point(s) spaced apart from the wiring line under the second electrode.
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