A fully packaged 25 Gbps/channel WDM photoreceiver module based on a Silicon Photonic Integrated Circuit and a flip-chipped CMOS quad transimpedance amplifier

摘要

Growing demand for bandwidth in Datacom optical links and High Performance Computers (HPC) has recently led to new optoelectronic modules based on Silicon Photonics Integrated Circuits [1]. One of the intrinsic capabilities of this technology is its scalability in terms of aggregated data rate, due to the possibility of combining Space Division Multiplexing, Wavelength Division Multiplexing, and the use of advanced modulation formats such as PAM4 or QPSK [2]. As a result, standard commercial modules using Silicon Photonics Integrated Circuits (Si-PIC), typically providing 10 to 25 Gbps (OOK) per channel over several singlemode fibers, will evolve up to and beyond 400 Gbps and more aggregated data rate in the coming years. In this paper, we demonstrate the introduction of Wavelength Division Multiplexing in a multichannel photoreceiver module using a Si-PIC, at a data rate of 25 Gbps per channel.