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首页> 外文期刊>International journal of food properties >Dielectric and Thermal Properties of Rice Cake Formulations Containing Different Gums Types
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Dielectric and Thermal Properties of Rice Cake Formulations Containing Different Gums Types

机译:含不同胶质类型的米饼配方的介电和热学性质

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摘要

In this study, dielectric properties of rice cake formulations containing different gum types (xanthan, guar, locust bean, HPMC, and kappa-carrageenan) were determined at temperatures between 25 and 90°C at 2450 MHz. Moreover, thermal properties of these formulations were determined by using differential scanning calorimeter (DSC). Dielectric properties of cake batters were found to be dependent on cake formulation. Xanthan and guar gum containing cake batters had the highest dielectric constant and loss factor values at 25°C. Temperature dependence of dielectric properties was not significant until temperature of 85°C. Gelatinization enthalpy of batter increased with the addition of gums.
机译:在这项研究中,在2550至90°C的温度和2450 MHz下测定了包含不同口香糖类型(黄原胶,瓜尔豆,刺槐豆,HPMC和κ-角叉菜胶)的年糕配方的介电性能。此外,通过使用差示扫描量热仪(DSC)来确定这些制剂的热性能。发现面糊的介电性能取决于饼的配方。含黄原胶和瓜尔胶的面糊在25°C时具有最高的介电常数和损耗因子值。介电性能的温度依赖性直到85℃才变得显着。面糊的糊化焓随口香糖的添加而增加。

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