On Improving Interconnect Defect Diagnosis Resolution and Yield for Interposer-Based 3-D ICs

Chi C.; Lin B.; Wu C.; Wang M.; Lin H.; Peng C.

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On Improving Interconnect Defect Diagnosis Resolution and Yield for Interposer-Based 3-D ICs

机译：基于中介层的3-D IC的互连缺陷诊断分辨率和良率的提高

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来源
《Design & Test of Computers, IEEE》 |2014年第4期|16-26|共11页
作者
Chi C.; Lin B.; Wu C.; Wang M.; Lin H.; Peng C.;
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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类
关键词
Built-in self-test; Integrated circuit interconnections; Maintenance engineering; Redundancy; Three dimensional displays; Through-silicon vias; 3D-IC; TSV; defect diagnosis; interconnect BIST; interconnect repair; interposer test; yield enhancement;

机译：内置自检;集成电路互连;维修工程;冗余;三维显示器;硅通孔;3D-IC;TSV;缺陷诊断;互连BIST;互连维修;中介层测试;提高产量;

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On Improving Interconnect Defect Diagnosis Resolution and Yield for Interposer-Based 3-D ICs

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