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A high resolution diagnosis technique for open and short defects in FPGA interconnects

机译:针对FPGA互连中的开路和短路缺陷的高分辨率诊断技术

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A two-step diagnosis flow, coarse-grain and fine-grain, is presented in order to identify a faulty element in the FPGA interconnects. The fault models used for interconnect are open, resistive-open, and bridging fault. The coarse-grain phase identifies the faulty net, the routing between two consecutive sequential elements in the FPGA. This phase is performed by just post-processing tester results for the test configurations used for interconnect testing. During the fine-grain step, the faulty net is rerouted without using some of the resources used in the original routing. The faulty element, programmable switch or wire segment, is uniquely identified based on the tester output for the rerouted configurations. Effective search methods are exploited in order to minimize the number of test configurations and the total diagnosis time. This method is implemented on real FPGA chips and verified using hardware fault emulation.
机译:提出了两步诊断流程:粗粒度和细粒度,以识别FPGA互连中的故障元件。用于互连的故障模型是开路,电阻开路和桥接故障。粗粒度阶段识别出故障的网络,即FPGA中两个连续的顺序元素之间的路由。此阶段仅通过对用于互连测试的测试配置的测试器结果进行后处理来执行。在细粒度步骤中,对故障网络进行重新路由,而无需使用原始路由中使用的某些资源。故障元件,可编程开关或线段是根据测试仪输出的重新布线配置来唯一标识的。为了减少测试配置的数量和总的诊断时间,开发了有效的搜索方法。该方法在实际的FPGA芯片上实现,并使用硬件故障仿真进行了验证。

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