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Photonic Networks-on-Chip for Future Generations of Chip Multiprocessors

机译:芯片上的光子网络用于芯片多处理器的后代

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摘要

The design and performance of next-generation chip multiprocessors (CMPs) will be bound by the limited amount of power that can be dissipated on a single die. We present photonic networks-on-chip (NoC) as a solution to reduce the impact of intra-chip and off-chip communication on the overall power budget. A photonic interconnection network can deliver higher bandwidth and lower latencies with significantly lower power dissipation. We explain why on-chip photonic communication has recently become a feasible opportunity and explore the challenges that need to be addressed to realize its implementation. We introduce a novel hybrid micro-architecture for NoCs combining a broadband photonic circuit-switched network with an electronic overlay packet-switched control network. We address the critical design issues including: topology, routing algorithms, deadlock avoidance, and path-setup/tear-down procedures. We present experimental results obtained with POINTS, an event-driven simulator specifically developed to analyze the proposed idea, as well as a comparative power analysis of a photonic versus an electronic NoC. Overall, these results confirm the unique benefits for future generations of CMPs that can be achieved by bringing optics into the chip in the form of photonic NoCs.
机译:下一代芯片多处理器(CMP)的设计和性能将由可以在单个模具上消散的有限功率限制。我们将光子网络上(NOC)作为一种解决方案,以减少芯片内和片外通信对整体电力预算的影响。光子互连网络可以提供更高的带宽和下延迟,具有显着较低的功耗。我们解释为什么片上的光子通信最近成为可行的机会,探索需要解决的挑战,以实现其实现。我们介绍了一种用于NOC的新型混合微架构,所述NOCS与电子覆盖分组交换控制网络组合宽带光子电路交换网络。我们解决了关键设计问题,包括:拓扑,路由算法,死锁避免和路径设置/拆除过程。我们提出了点的实验结果,该事件驱动的模拟器专门开发用于分析所提出的想法,以及光子与电子NOC的比较功率分析。总的来说,这些结果证实了未来几代CMP的独特益处,可以通过以光子NOC的形式带来光学器件来实现的。

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