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Test Algorithms for ECC-Based Memory Repair in Ultimate CMOS and Post-CMOS

机译:终极CMOS和后CMOS中基于ECC的内存修复的测试算法

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In modern SoCs embedded memories should be protected by ECC against field failures to achieve acceptable reliability. They should also be repaired after fabrication to achieve acceptable fabrication yield. In technologies affected by high defect densities, conventional repair induces very high costs. To reduce it, we can use ECC-based repair, consisting in using the ECC for fixing words comprising a single faulty cell and self-repair to fix all other faulty words. However, as we show in this paper, for high defect densities the diagnosis circuitry required for ECC-based repair may induce very large hardware cost. To fix this issue, we introduce a new family of memory test algorithms that exhibit a property we termed as “single-read double-fault detection”. This approach gains interest in ultimate CMOS and post-CMOS technologies, where the defect densities are expected to increase significantly, and/or in very-low power design, as very-low voltage sharply increases defect densities.
机译:在现代SoC中,嵌入式存储器应受ECC保护,以防发生现场故障,以实现可接受的可靠性。它们也应在制造后进行修理以达到可接受的制造良率。在受高缺陷密度影响的技术中,常规维修会产生很高的成本。为了减少它,我们可以使用基于ECC的修复,包括使用ECC修复包含单个故障单元的单词,并使用自我修复功能修复所有其他故障单词。但是,正如我们在本文中所显示的,对于高缺陷密度,基于ECC的修复所需的诊断电路可能会导致非常大的硬件成本。为了解决此问题,我们引入了一个新的内存测试算法系列,这些算法具有一种称为“单读双故障检测”的属性。这种方法引起了人们的关注,因为最终的CMOS和后CMOS技术中的缺陷密度预计会显着增加,和/或在非常低的功耗设计中,由于非常低的电压会急剧增加缺陷密度。

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