机译:用于高带宽和低成本的2.5D玻璃中介层BGA封装的设计和演示
Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA;
Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA;
Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA;
Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA;
Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA;
Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA;
Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA;
Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA;
Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA;
Glass; Silicon; Packaging; Bandwidth; Substrates; Reliability; Dielectrics;
机译:低成本薄玻璃中介层可替代硅和有机中介层,用于封装3-D IC
机译:双面3-D玻璃中介层封装中具有有效谐振抑制能力的输电网络的设计和演示
机译:2–5-
机译:用于3D玻璃光子插入器中的低损耗和低成本单模光纤耦合的微镜和透镜的设计和演示
机译:硅和玻璃中介层中通孔的建模,设计和表征
机译:低成本基板上具有带宽和增益增强功能的印刷宽缝天线设计
机译:用于高带宽智能移动应用的超高I / O密度玻璃/硅中介层