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BGA PACKAGE, METHOD OF MANUFACTURING THE SAME FOR REDUCING FABRICATION COST AND SIMPLIFYING MANUFACTURING PROCESSES, AND STACKED STRUCTURE OF BGA PACKAGE
BGA PACKAGE, METHOD OF MANUFACTURING THE SAME FOR REDUCING FABRICATION COST AND SIMPLIFYING MANUFACTURING PROCESSES, AND STACKED STRUCTURE OF BGA PACKAGE
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机译:BGA封装,用于降低制造成本并简化制造过程的相同方法以及BGA封装的堆叠结构
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摘要
PURPOSE: A BGA(Ball Grid Array) package, a manufacturing method thereof and a stacked structure of BGA package are provided to simplify remarkably manufacturing processes and to economize fabrication cost by attaching solder balls to a semiconductor chip before an encapsulation process. CONSTITUTION: A BGA package includes a substrate(220), a semiconductor chip(200) on the substrate, a plurality of solder balls(260) on the chip, and an encapsulating member. The encapsulating member(280) is used for enclosing the chip except solder balls. A bonding wire(270) connects the chip with the substrate within the encapsulating member.
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