机译:3-D集成中的硅芯同轴硅通孔的电学建模和表征
Faculty of Electrical Engineering and Computer Science, Ningbo University, Ningbo, China;
Faculty of Electrical Engineering and Computer Science, Ningbo University, Ningbo, China;
Faculty of Electrical Engineering and Computer Science, Ningbo University, Ningbo, China;
Faculty of Electrical Engineering and Computer Science, Ningbo University, Ningbo, China;
Faculty of Electrical Engineering and Computer Science, Ningbo University, Ningbo, China;
Through-silicon vias; Conductors; Silicon; Integrated circuit modeling; Dielectric losses; Analytical models;
机译:3-D集成中硅同轴通孔的宽带阻抗模型
机译:3-D集成电路的硅通孔(TSV)的电气建模和表征
机译:3-D IC的同轴硅通孔的频率和温度相关建模
机译:3D集成电路的直通硅晶通孔(TSV)的电气建模和表征
机译:三维(3D)集成中的直通孔(TSV)的电气评估和建模。
机译:量身定制飞秒的1.5μm贝塞尔光束以制造高纵横比的硅通孔
机译:Synchrotron X射线Microdiffraction对3-D集成的通过硅通孔通孔的可靠性的调查研究