首页> 外文OA文献 >Synchrotron X-Ray Microdiffraction Investigation of Scaling Effects on Reliability for Through-Silicon Vias for 3-D Integration

【2h】

Synchrotron X-Ray Microdiffraction Investigation of Scaling Effects on Reliability for Through-Silicon Vias for 3-D Integration

机译：Synchrotron X射线Microdiffraction对3-D集成的通过硅通孔通孔的可靠性的调查研究

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Laura Spinella; Tengfei Jiang; Nobumichi Tamura; Jang-Hi Im; Paul S. Ho;
展开▼
作者单位

展开▼
年度 2019
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Synchrotron X-Ray Microdiffraction Investigation of Scaling Effects on Reliability for Through-Silicon Vias for 3-D Integration [J] . Laura Spinella, Tengfei Jiang, Nobumichi Tamura, IEEE transactions on device and materials reliability . 2019,第3期

机译：同步辐射X射线微衍射研究尺度效应对3D集成硅通孔可靠性的影响
2. Characterization of local strain/stress in copper through-silicon via structures using synchrotron x-ray microdiffraction, electron backscattered diffraction and nonlinear thermomechanical model [J] . Song Ming, Mundboth Kiran R., Szpunar Jerzy A., Journal of Micromechanics and Microengineering . 2015,第8期

机译：使用同步加速器X射线微衍射，电子背散射衍射和非线性热力学模型表征铜直通硅通孔结构中的局部应变/应力
3. In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation [J] . Xi Liu, Paragkumar A. Thadesar, Christine L. Taylor, Applied Physics Letters . 2014,第11期

机译：通过同步加速器X射线微衍射通过应变测量进行原位微米级贯穿硅，探索数据解释背后的物理原理
4. Comparison of mechanical stresses of Cu Through-Silicon Via (TSV) samples fabricated by Hynix vs. SEMATECH using synchrotron X-ray microdiffraction for 3-D integration and reliability [C] . Budiman A.S., Shin H., Kim B.-J., Interconnect Technology Conference (IITC), 2012 IEEE International . 2012

机译：Hynix与SEMATECH利用同步加速器X射线微衍射对3-D集成和可靠性制造的铜硅通孔（TSV）样品的机械应力进行比较
5. The Scaling and Microstructure Effects on the Thermal Stress and Reliability of Through-Silicon Vias in 3D Integrated Circuits [D] . Spinella, Laura Emilie. 2017

机译：对3D集成电路中通过硅通孔的热应力和可靠性的缩放和微观结构效应
6. Synchrotron X-ray Microdiffraction and Fluorescence Imaging of Mineral and Rock Samples [O] . Camelia V. Stan, Nobumichi Tamura 2018

机译：矿物质和岩石样品的同步X射线微细胞和荧光成像
7. Effect of Thermal Stresses on Carrier Mobility and Keep-Out Zone Around Through-Silicon Vias for 3-D Integration [O] . Suk-kyu Ryu, Kuan-hsun Lu, Tengfei Jiang, 2013

机译：热应力对3D集成硅通孔周围的载流子迁移率和保留区的影响

Synchrotron X-Ray Microdiffraction Investigation of Scaling Effects on Reliability for Through-Silicon Vias for 3-D Integration

著录项

引文网络

相似文献

相关主题

期刊订阅