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Poor Hole-Filling with Pb-Free Wave Soldering?

机译:无铅波峰焊填充不良?

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摘要

When the soldering process is converted to Pb-free, one may often find solder connections where hole filling is not complete. This was not much of a problem when boards were soldered with common SnPb alloys. It sometimes occurred due to incorrect process settings, such as insufficient flux. Now, with Pb-free soldering, these problems seem to be part of the process as they cannot be reduced even with optimal settings.
机译:当将焊接过程转换为无铅工艺时,经常会发现未完全填充孔的焊料连接。当用普通的SnPb合金焊接板时,这并不是什么大问题。有时是由于工艺设置不正确(例如通量不足)而发生的。现在,在无铅焊接中,这些问题似乎已成为过程的一部分,因为即使采用最佳设置也无法减少这些问题。

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