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A Novel Low Melting Point Pb-Free Solder

机译:一种新型的低熔点无铅焊料

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摘要

Many organizations, such as iNEMI, the National Center for Manufacturing Sciences, Improved Design life and Environmentally Aware manufacture by Lead-free Soldering (IDEALS) and the Japan Electronic Industry Development Association (JEIDA) have recommended certain Pb-free alloys. The most common recommendations are SnAg (including SnAgCu, or SAC), SnCu, SnZn and SnBi solders. SnAg solders, e.g., SnAgAg, SnAg3.0Cu0.5 (as recommended by JEIDA and NCMS), SnAg3.8AgCu0.7 (recommended by IDEALS) and SnAg3.9AgCu0.6 (recommended by iNEMI) have good mechanical and thermal properties, but their wettability to copper surfaces is poor and their cost is high.
机译:许多组织,例如iNEMI,国家制造科学中心,通过无铅焊接(IDEALS)改善设计寿命和提高环境意识的制造以及日本电子工业发展协会(JEIDA)都推荐了某些无铅合金。最常见的建议是SnAg(包括SnAgCu或SAC),SnCu,SnZn和SnBi焊料。 SnAg焊料,例如SnAgAg,SnAg3.0Cu0.5(由JEIDA和NCMS推荐),SnAg3.8AgCu0.7(由IDEALS推荐)和SnAg3.9AgCu0.6(由iNEMI推荐)具有良好的机械和热性能,但它们对铜表面的润湿性差并且成本高。

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