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Pole-Controlled Wideband 120 GHz CMOS Power Amplifier for Wireless Chip-to-Chip Communication in 40-nm CMOS Process

机译:极点控制的宽带120 GHz CMOS功率放大器,用于40 nm CMOS工艺中的无线芯片间通信

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摘要

This brief proposes a wideband CMOS power amplifier (PA) with flat gain using a pole-controlled transformer in the sub-THz band for wireless chip-to-chip communication. An analysis of the transformer-based interstage matching network is presented, which indicates a zero in-band ripple condition. For verification, a pole-controlled PA (with an area of 0.33 mm(2) including PADs) is fabricated using a 40-nm CMOS process and measured. The proposed PA achieves a measured 3-dB bandwidth of 38.5 GHz from 96.5 GHz-to-135 GHz, small-signal gain of 15.8 dB, and saturated output power of 14.6 dBm with a peak power-added efficiency (PAE(MAX)) of 9.44%. The proposed PA shows state-of-the-art performance with respect to the bandwidth and other figures of merit.
机译:本简介提出了一种使用平坦的增益的宽带CMOS功率放大器(PA),该放大器在亚THz频段内使用极点控制的变压器进行无线芯片间通信。给出了对基于变压器的级间匹配网络的分析,该分析表明带内纹波条件为零。为了进行验证,使用40 nm CMOS工艺制造并测量了一个杆控功率放大器(包括PAD在内的面积为0.33 mm(2))并进行了测量。拟议的功率放大器在96.5 GHz至135 GHz范围内可实现38.5 GHz的测量3 dB带宽,15.8 dB的小信号增益和14.6 dBm的饱和输出功率,并具有峰值功率附加效率(PAE(MAX))占9.44%。拟议的PA显示出有关带宽和其他品质因数的最新性能。

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