New BGA Solder Mask Repair Technique Using Laser Cut Stencils

摘要

The increased replacement of high lead count SMT devices with BGAs and other high ball count area array packages has brought increased challenges to PCB rework and repair. Often solder mask areas surrounding BGA pad areas are damaged when components are removed. In the "dogbone" areas connecting BGA pads to the associated vias, solder mask serves to stop solder from wicking down into the via.