Fine Lines in High Yield (Part CLXVI)

摘要

The Tech Talk column, now in its 15th year, has mainly focused on circuit board fabrication issues. But over the years, related topics from first-level packaging and other interconnect technologies have also been increasingly covered. Discussing through-silicon-via (TSV) technology in this column is a bit of a stretch. But it might be of interest to look at processes such as hole formation, insulation, metallization, and etching and check for similarities and differences between TSV processing and first- and second-level packaging. Part A of this two part series is focusing on via formation, while Part B will deal with metallization processes.