New State-of-Art Dry Film Technology for Fine Lines in High Yield

摘要

Dry film photoresist to produce highly integrated and advanced PWBs has been developed to meet more demanding fine line requirements. Advantages for volume production of fine features below 50μm with high yield are now available with newly developed dry film photoresist that is designed to have specific features. In order to develop such a highly reliable dry film photoresist, Quality Function Deployment (QFD) helped significantly to well interpret 'Voice-Of-the-Customer' (VOC) into specific requirement of dry film photoresist performance and how it can be achieved by formulation design. The developed dry film photoresist resulted in L/S resolution and isolated adhesion better than 1:1 aspect ratio to thickness, with very wide exposure range, and with wide developing latitude.