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High yield, fine lines, how to form multi-charge printed wiring board panels
High yield, fine lines, how to form multi-charge printed wiring board panels
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机译:高产量,细线,如何形成多电荷印刷线路板面板
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摘要
In operating a printed wiring board innerlayer panel having a thin copper substrate, a protective laminate is held on top to aid in final stacking enhancement for the multilayer thin film. At the intermediate stage, the circuit pattern is inspected and the defective pattern is replaced by the operation pattern during the stacking process prior to the multilayer thinning.
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