PROTECTIVE FILM LAMINATED FINE STRUCTURE, AND DRYING METHOD FOR FINE STRUCTURE USING THE PROTECTIVE FILM LAMINATED FINE STRUCTURE

摘要

PROBLEM TO BE SOLVED: To prevent a pattern from being destroyed by preventing the surface of a fine structure of a substrate or the like from being naturally dried in the atmosphere, when the fine structure of the semiconductor substrate is dried after it is developed with a liquefied or supercritical fluid.;SOLUTION: The protective film laminated fine structure is adapted in a process using a liquefied or supercritical fluid before it is dried in a high pressure container, a protective film comprising a highly viscous substance is formed on the surface of the fine structure.;COPYRIGHT: (C)2004,JPO