首页> 外文期刊>Automation Science and Engineering, IEEE Transactions on >Hierarchical Production Planning for Semiconductor Wafer Fabrication Based on Linear Programming and Discrete-Event Simulation
【24h】

Hierarchical Production Planning for Semiconductor Wafer Fabrication Based on Linear Programming and Discrete-Event Simulation

机译:基于线性规划和离散事件仿真的半导体晶圆制造分层生产计划

获取原文

摘要

This paper focuses on a production planning and scheduling problem in a semiconductor wafer fabrication facility. We propose a two-level hierarchical production planning (HPP) method that employs an itmmerative procedure for production planning and operations scheduling. In the method, production plans are obtained with a linear programming (LP) model in the aggregate level, and schedules at the machines are obtained with a priority-rule-based scheduling method and evaluated with discrete-event simulation in the disaggregate level. An iterative scheme is adopted for obtaining a good and feasible production plan. The proposed method is evaluated through simulation experiments and the results show that the method works better than an existing algorithm in terms of the total production cost and total tardiness of orders.
机译:本文重点讨论半导体晶圆制造设备中的生产计划和调度问题。我们提出了一种两级分层生产计划(HPP)方法,该方法采用迭代过程进行生产计划和操作计划。在该方法中,使用总体规划中的线性规划(LP)模型获得生产计划,并使用基于优先级规则的调度方法获得机器的调度,并在分解层次中使用离散事件模拟对其进行评估。为获得良好可行的生产计划,采用了迭代方案。通过仿真实验对提出的方法进行了评估,结果表明该方法在总生产成本和订单总延误方面比现有算法更好。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号