Thermal stress intensity factors for an interface crack in a functionally graded layered structures

摘要

The fracture behavior of a functionally graded layered structure (FGLS) with an interface crack under thermal loading is investigated. Considering new boundary conditions, it is assumed that interface crack is partly insulated, and the temperature drop across the crack surfaces is the result of the thermal resistance due to the heat conduction through the crack region. The problem is formulated in terms of a system of singular integral equations. Numerical results are presented to show the influence of the material nonhomogeneity parameters and the dimensionless thermal resistance on the thermal stress intensity factors (TSIFs).