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Crack tip stress fields and creep crack growth of interface cracks in functionally graded/layered materials

机译:裂纹尖端应力场和功能分层材料中裂缝裂缝的蠕变裂纹增长

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In this study, the growth behavior of interface cracks in bimaterials and in graded/layered materials resulting from the creep cavitation was studied. The growth model includes the effects of material deposition resulting from the growth of creepcavities on the crack tip stress fields. The results indicate that in graded/layered materials under identical applied loading, the location of the interface crack strongly influence the amplitude of the stress field (C*) at steady-state. Due to largevariation in the distribution of the stresses ahead of the interface cracks at creep regime, depending upon the crack location, the creep crack growth rates will be significantly different from each other under identical loading for a given graded/layered material.
机译:在该研究中,研究了双材料中裂缝和由蠕变空化产生的分层材料中的界面裂缝的生长行为。生长模型包括材料沉积引起的材料沉积产生的效果由裂缝尖端应力场的生长产生。结果表明,在相同的施加负载下的渐变/分层材料中,界面裂缝的位置强烈影响稳态处应力场(C *)的幅度。由于在蠕变状态下的界面裂缝前方的压力分布的范围内,根据裂缝位置,蠕变裂纹的生长速率在给定分级/层状材料的相同装载下彼此显着不同。

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