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Strengthening mechanisms of graphene coatings on Cu film under nanoindentation: A molecular dynamics simulation

机译:纳米狭窄下石墨烯涂层对Cu膜的强化机理:分子动力学模拟

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Molecular dynamics simulations of nanoindentation are performed to investigate the strengthening mechanisms of graphene coatings on Cu film substrate. It is found that the load bearing capacity of Cu substrate can be evidently improved after covering graphene coatings, and this turns out to be proportional to the number of graphene layers from monolayer to trilayer. The strengthening mechanism of elastic stage mainly results from the stress homogenization effect generated by graphene interface. Moreover, the efficiency of graphene strengthening during plastic stage is much higher than the elastic stage. The interactions between dislocations and graphene coating interface are fully responsible for the strengthening increase of Cu/graphene system in the plastic stage. In addition, a theoretical model to predict the strength of Cu/graphene system depending on the confined layer slip (CLS) model is established.
机译:进行纳米茚的分子动力学模拟,以研究石墨烯涂层对Cu膜基材的强化机制。结果发现,在覆盖石墨烯涂层之后,可以显着改善Cu基板的承载能力,并且这结果与来自单层到三层的石墨烯层的数量成比例。弹性阶段的强化机制主要由石墨烯界面产生的应力均质化效应产生。此外,塑料阶段的石墨烯强化效率远高于弹性级。脱位和石墨烯涂层界面之间的相互作用是完全负责塑性阶段中Cu /石墨烯系统的增加。另外,建立了根据限制层滑移(CLS)模型来预测Cu /石墨烯系统强度的理论模型。

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