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Strengthening mechanisms of graphene coatings on Cu film under nanoindentation: A molecular dynamics simulation

机译:纳米压痕下Cu膜上石墨烯涂层的强化机理:分子动力学模拟

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Molecular dynamics simulations of nanoindentation are performed to investigate the strengthening mechanisms of graphene coatings on Cu film substrate. It is found that the load bearing capacity of Cu substrate can be evidently improved after covering graphene coatings, and this turns out to be proportional to the number of graphene layers from monolayer to trilayer. The strengthening mechanism of elastic stage mainly results from the stress homogenization effect generated by graphene interface. Moreover, the efficiency of graphene strengthening during plastic stage is much higher than the elastic stage. The interactions between dislocations and graphene coating interface are fully responsible for the strengthening increase of Cu/graphene system in the plastic stage. In addition, a theoretical model to predict the strength of Cu/graphene system depending on the confined layer slip (CLS) model is established.
机译:进行了纳米压痕的分子动力学模拟,以研究石墨膜在铜膜基底上的强化机理。结果发现,覆盖石墨烯涂层后,铜基体的承载能力明显提高,这与石墨烯从单层到三层的层数成正比。弹性阶段的强化机理主要是由石墨烯界面产生的应力均质作用引起的。此外,塑性阶段的石墨烯增强效率远高于弹性阶段。位错和石墨烯涂层界面之间的相互作用完全负责塑性阶段中Cu /石墨烯体系的增强。此外,建立了基于受限层滑移(CLS)模型预测铜/石墨烯体系强度的理论模型。

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