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Micro-patterning of self-supporting layers with conducting polymer wires for 3D-chip interconnection applications

机译:自支撑层与导电聚合物线的微图案化,用于3D芯片互连应用

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Highly conducting polymers have attracted much interest because of their potential applications in sensors and electronic devices. By the use of templates like porous membranes during polymerization conducting molecular wires can be formed with highly anisotropic properties which can be used as interconnecting layers in a three-dimensional (3D)-chip stacking. We focussed on two electrochemical polymerization (ECP) techniques to produce molecular wires based on polypyrrole (PPy) embedded in isolating porous polycarbonate membranes as self-supporting layers. The growth of the polymer through the membrane pores was investigated in order to achieve a good conductivity through the pores, but with a small cross-talk between them. A new polymerization technique based on a structured cathode has been developed in order to control the polymerization locally. By that technique micro-patterned membranes with separated conducting polymer wires could be produced.
机译:高导电性聚合物由于其在传感器和电子设备中的潜在应用而引起了人们的极大兴趣。通过在聚合过程中使用诸如多孔膜之类的模板,可以形成具有高度各向异性的分子导线,该分子导线可以用作三维(3D)芯片堆叠中的互连层。我们专注于两种电化学聚合(ECP)技术,以基于嵌入在隔离多孔聚碳酸酯膜中作为自支撑层的聚吡咯(PPy)的分子线。研究了聚合物在膜孔中的生长,以实现通过孔的良好导电性,但它们之间的串扰很小。为了局部控制聚合,已经开发了基于结构化阴极的新聚合技术。通过该技术,可以生产具有分离的导电聚合物线的微图案膜。

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