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Fibre Laser Welding For Packaging Of Disposable Polymeric microfluidic-biochips

机译:用于一次性聚合物微流控生物芯片包装的光纤激光焊接

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An essential step in the development of microfluidic-biochips is represented by the assembly process. Among the thermal bonding processes used for the assembly of such devices the laser transmission welding of polymers offers several advantages, especially when it comes about local deposition of energy and minimum thermal distortion in the joining components. The research presented in this paper proposes a new approach for the laser transmission welding developed for the packaging of disposable polymeric microfluidic-biochips. The new approach based on the use of a fibre laser and a tailored method for the laser energy deposition was tested on the sealing of polymeric biochips made from plexiglas and polypropylene with a covering foil. This method combines the characteristics of the polymer contour welding and quasi-simultaneous welding and allows the achievement of contamination-free, high quality weld seams as narrow as 100 μm with a high dynamic making it suitable for the high volume production also.
机译:组装过程代表了微流控生物芯片开发中的关键步骤。在用于组装这种装置的热粘合工艺中,聚合物的激光透射焊接具有几个优点,特别是在能量局部沉积和在连接部件中产生最小热变形时。本文提出的研究提出了一种用于一次性聚合物微流控生物芯片包装的激光透射焊接新方法。在使用有机玻璃和聚丙烯制成的聚合物生物芯片与覆盖箔纸的密封性上,测试了基于使用光纤激光器和量身定制的激光能量沉积方法的新方法。这种方法结合了聚合物轮廓焊接和准同时焊接的特点,可以实现无污染,窄至100μm的高质量焊缝以及高动态性能,使其也适用于大批量生产。

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