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Study Of Electronic Structures For Fe Thin Films Deposited On si- And C-faces Of 4h-sic Substrates By Soft x-ray Emission Spectroscopy

机译:用软X射线发射光谱研究4h-sic衬底的Si和C面上沉积的Fe薄膜的电子结构

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Silicon carbide (SiC) is a candidate material for electronic devices to operate upon crucial environment. Electronic states of silicides and/or carbide/graphite formed in metal/SiC contact system are fundamentally important from the viewpoint of device performance. We study interface electronic structure of iron thin film deposited on silicon (Si)- and carbon (C)-face of 4H-SiC(0001) by using a soft X-ray emission spectroscopy (SXES). For specimens of Fe (50 nm)/4H-SiC (substrate) contact systems annealed at 700 and 900 ℃, the Si L_(2,3) emission spectra indicate different shapes and peak energies from the substrate depending on thermal-treated temperature. The product of materials such as silicides is suggested. Further, from comparison of Si L_(2,3) emission spectra between Si- and C-face for the same annealing temperature at 700 ℃, it is concluded that the similar silicides and/or ternary materials are formed on the two surfaces. However for those of 900 ℃, the film on substrate is composed of the different silicide and/or ternary materials.
机译:碳化硅(SiC)是电子设备在关键环境下运行的候选材料。从器件性能的角度来看,在金属/ SiC接触系统中形成的硅化物和/或碳化物/石墨的电子状态至关重要。我们使用软X射线发射光谱法(SXES)研究了沉积在4H-SiC(0001)的硅(Si)-和碳(C)面上的铁薄膜的界面电子结构。对于在700和900℃退火的Fe(50 nm)/ 4H-SiC(衬底)接触系统的样品,Si L_(2,3)发射光谱表明,取决于热处理温度,衬底的不同形状和峰值能量。建议使用硅化物等材料的产品。此外,通过比较在700℃相同退火温度下Si面和C面之间的Si L_(2,3)发射光谱,可以得出结论,在两个表面上形成了相似的硅化物和/或三元材料。但是对于900℃的那些,衬底上的膜是由不同的硅化物和/或三元材料组成的。

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