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Influence of Si-C bond density on the properties of a-Si_(1-x)C_x thin films

机译:Si-C键密度对a-Si_(1-x)C_x薄膜性能的影响

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Amorphous silicon carbide (a-Si_(1_x)C_x) films were deposited on silicon (100) and quartz substrates by pulsed DC reactive magnetron sputtering of silicon in methane (CH_4)-Argon (Ar) atmosphere. The influence of substrate temperature and target power on the composition, carbon bonding configuration, band gap, refractive index and hardness of a-SiC films has been investigated. Increase in substrate temperature results in slightly decreasing the carbon concentration in the films but favors silicon-carbon (Si-C) bonding. Also lower target powers were favorable towards Si-C bonding. X-ray photoelectron spectroscopy (XPS) results agree with the Fourier Transform Infrared (FTIR), UV-vis spectroscopy results. Increase in substrate temperature resulted in increased hardness of the thin films from 13 to 17GPa and the corresponding bandgap varied from 2.1 to 1.8 eV.
机译:通过在甲烷(CH_4)-氩气(Ar)气氛中对硅进行脉冲DC反应磁控溅射,在硅(100)和石英基板上沉积非晶碳化硅(a-Si_(1_x)C_x)膜。研究了衬底温度和目标功率对a-SiC膜的组成,碳键构型,带隙,折射率和硬度的影响。基板温度的升高会导致膜中碳的浓度略有降低,但有利于硅碳(Si-C)键合。较低的目标功率也有利于Si-C键合。 X射线光电子能谱(XPS)的结果与傅立叶变换红外(FTIR),紫外可见光谱的结果一致。基板温度的升高导致薄膜的硬度从13GPa增加到17GPa,相应的带隙在2.1eV至1.8eV之间变化。

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