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Influence of processing conditions on the structure, composition and ferroelectric properties of sputtered PZT thin films on Ti-substrates

机译:加工条件对Ti基溅射PZT薄膜结构,组成和铁电性能的影响

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PZT thin (~500nm) films are synthesized on titanium (Ti) substrates by r.f. magnetron sputtering under various processing conditions. Present work aims to investigate the influence of working pressure and post-annealing temperature on the quality of the films. Phase evolution, surface morphology with local chemical composition and dielectric/ferroelectric properties of PZT films have been studied as the functions of working pressure and post-annealing temperature. A working pressure of ~0.7 Pa and a post-crystallization temperature of ~650℃ are found to be the optimum processing conditions for growing perovskite PZT films on Ti-substrates. Irrespective of processing conditions, however, all PZT films on Ti-substrates show poor electrical response. Depth dependent change in the chemical states of Pb, Zr, Ti and oxygen within the PZT films and across the PZT/Ti interfaces has also been scrutinized by XPS depth profiling. It is observed that within PZT films, Pb exists both in Pb~(2+) and Pb~0 (metallic-Pb) states. Surfaces of the PZT films are found to be enriched with a thin (~60 nm) Pb-deficient and Zr-rich pyrochlore/fluorite (Py/Fl) phase. Existence of a thin titanium oxide layer in the form of a TiCh/TiO stack has also been confirmed at the PZT/Ti interface. Processing conditions dependant structural modifications have been correlated with the dielectric and ferroelectric properties of the films.
机译:射频法在钛(Ti)衬底上合成了PZT薄膜(约500nm)。在各种处理条件下进行磁控溅射。目前的工作旨在研究工作压力和退火后温度对薄膜质量的影响。研究了PZT薄膜的相变,具有局部化学成分的表面形貌以及PZT薄膜的介电/铁电性能,它们是工作压力和退火后温度的函数。发现在钛基体上生长钙钛矿PZT薄膜的最佳工艺条件为〜0.7 Pa的工作压力和〜650℃的后结晶温度。但是,不管处理条件如何,Ti基板上的所有PZT膜均显示出不良的电响应。 XPS深度剖析也仔细研究了PZT膜内以及整个PZT / Ti界面中Pb,Zr,Ti和氧的化学状态的深度依赖性变化。观察到在PZT膜中,Pb以Pb〜(2+)和Pb〜0(金属-Pb)状态存在。发现PZT膜的表面富含薄(〜60 nm)的Pb缺乏和富Zr的烧绿石/萤石(Py / Fl)相。在PZT / Ti界面上也已经确认了以TiCh / TiO叠层形式存在的氧化钛薄层。依赖于加工条件的结构修饰已与薄膜的介电和铁电性能相关。

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